Sabtu, 07 Maret 2015
Omnivision to Settle With Class Lawsuit
Courthouse News Service: A federal judge preliminary approved a $12.5M class settlement that claims that OmniVision misled shareholders into believing it had an exclusive contract related to the Apple iPhone 4. Shareholders claimed that the company CFO Anson Chan made false and misleading statements about the technological advantages of its image sensor versus its competitors', and its competitive position with customers such as Apple. These misrepresentations deceived the market into believing that OmniVision was maintaining its exclusive position as the supplier of image sensors for iPhone 4, causing Omnivision's stock to be artificially inflated, according to the lawsuit.
Jumat, 06 Maret 2015
Messages on Sony CCD Discontinuation
Vision Systems Design publishes a nice collection of various companies announcements of Sony stopping CCD production. Among them are Framos video, IDS announcement, and a private email from Vision Components saying that just one CCD model, the B&W 1.4MP, 6.45um pixel ICX285, escaped the axe so far:
Imaging Remains Major Power Consumer in Wearables
EETimes: TechInsights and eSoftThings analysed power consumption of 3 smart glasses: Google Glass, Vuzix M100, and Optinvent AR Glasses. Imaging functions consume the major power in all three devices:
Kamis, 05 Maret 2015
Rambus Launches Partners-in-Open-Development Program to Promote Lensless Sensors
Rambus announces its Partners-in-Open-Development (POD) program in collaboration with design firms frog and IXDS to promote the adoption of its lensless smart sensor (LSS) technology.
"Our Partners-in-Open-Development provides a great opportunity for innovators to develop technology for a smarter world. With this program, we encourage developers across the globe to join in to create new products that introduce real-world IoT applications that will touch so many parts of our lives. This is the first step toward expanding the accessibility of an ecosystem that will foster a new generation of innovation," said Gary Bronner, VP of Rambus Labs.
"Our work with lensless smart sensors through the POD program is helping to pave the way for innovations that are sure to inspire and become ubiquitous throughout our lives," said Andrew Zimmerman, president of frog. "The opportunity to partner with Rambus, through our R&D platform frogLabs and other organizations, to build out the burgeoning sensor ecosystem means we are helping to propel solutions that can be adopted much more quickly."
"Opening its innovative lensless smart technology to the developer community enables Rambus to promote what promises to be a robust, intelligent ecosystem around this new approach to sensing and imaging," said Dr. Reto Wettach, founder and design director with IXDS. "We are proud to be among the inaugural POD partners and look forward to being among the first contributors to identify and expand upon existing IoT-based applications for this technology."
Tom's Hardware publishes a nice article accompanied by a Youtube interview with Patrick Gill on the new developments:
"Our Partners-in-Open-Development provides a great opportunity for innovators to develop technology for a smarter world. With this program, we encourage developers across the globe to join in to create new products that introduce real-world IoT applications that will touch so many parts of our lives. This is the first step toward expanding the accessibility of an ecosystem that will foster a new generation of innovation," said Gary Bronner, VP of Rambus Labs.
"Our work with lensless smart sensors through the POD program is helping to pave the way for innovations that are sure to inspire and become ubiquitous throughout our lives," said Andrew Zimmerman, president of frog. "The opportunity to partner with Rambus, through our R&D platform frogLabs and other organizations, to build out the burgeoning sensor ecosystem means we are helping to propel solutions that can be adopted much more quickly."
"Opening its innovative lensless smart technology to the developer community enables Rambus to promote what promises to be a robust, intelligent ecosystem around this new approach to sensing and imaging," said Dr. Reto Wettach, founder and design director with IXDS. "We are proud to be among the inaugural POD partners and look forward to being among the first contributors to identify and expand upon existing IoT-based applications for this technology."
Tom's Hardware publishes a nice article accompanied by a Youtube interview with Patrick Gill on the new developments:
NHK and Forza Silicon Present 133MP/60 fps Sensor Internals
Business Wire: Forza Silicon announces that researchers at NHK presented the design architecture and specifications of the 133MP 60fps CMOS image sensor at ISSCC 2015. The image sensor presented by NHK was designed by Forza Silicon and fabricated using a 0.18 µm 3.3V/1.8V process with 1D stitching.
To date conventional image sensors for 8K applications have used 8 MP and 33 MP solutions in large optical formats. In order to eliminate the bulky lens/color-prism optical system of previous generation cameras, the team developed a single-chip 133 MP image sensor. The sensor takes advantage of Forza Silicon’s Gen 3 readout architecture to achieve frame frequency of 60 fps. The Gen 3 readout architecture uses a pseudo-column parallel design with 14b redundant successive approximation register ADCs to achieve a throughput of 128 Gb/s at full resolution and frame rate.
“Our continued partnership with Forza Silicon through the years to support NHK has resulted in the success of a number of significant projects such as the development of the 133 MP sensor, and previously the 33 MP Super Hi-Vision image sensor. Forza’s dedicated support and its image sensor design expertise enabled us to achieve the Super Hi-Vision 8K single-chip camera — the largest pixel count of any video image sensor,” said Dr. Hiroshi Shimamoto, senior research engineer at NHK Science & Technology Research Laboratories (STRL).
“The advanced research and development initiatives by NHK continue to push the boundaries for UHDTV broadcast experiences. NHK’s next-generation digital broadcast systems stem from their long heritage as the world’s premier R&D center for broadcast camera technology. The groundbreaking technologies we’ve jointly developed have evolved over a span of 10 years as a result of our tight collaboration, and Forza’s decades of design experience and wide selection of silicon-proven IP,” said Barmak Mansoorian, president & co-founder at Forza Silicon.
To date conventional image sensors for 8K applications have used 8 MP and 33 MP solutions in large optical formats. In order to eliminate the bulky lens/color-prism optical system of previous generation cameras, the team developed a single-chip 133 MP image sensor. The sensor takes advantage of Forza Silicon’s Gen 3 readout architecture to achieve frame frequency of 60 fps. The Gen 3 readout architecture uses a pseudo-column parallel design with 14b redundant successive approximation register ADCs to achieve a throughput of 128 Gb/s at full resolution and frame rate.
“Our continued partnership with Forza Silicon through the years to support NHK has resulted in the success of a number of significant projects such as the development of the 133 MP sensor, and previously the 33 MP Super Hi-Vision image sensor. Forza’s dedicated support and its image sensor design expertise enabled us to achieve the Super Hi-Vision 8K single-chip camera — the largest pixel count of any video image sensor,” said Dr. Hiroshi Shimamoto, senior research engineer at NHK Science & Technology Research Laboratories (STRL).
“The advanced research and development initiatives by NHK continue to push the boundaries for UHDTV broadcast experiences. NHK’s next-generation digital broadcast systems stem from their long heritage as the world’s premier R&D center for broadcast camera technology. The groundbreaking technologies we’ve jointly developed have evolved over a span of 10 years as a result of our tight collaboration, and Forza’s decades of design experience and wide selection of silicon-proven IP,” said Barmak Mansoorian, president & co-founder at Forza Silicon.
Toshiba Announces Mass Production of 20MP, 1.12um Pixel Sensor
Business Wire: Keeping up with its production schedule in the early product announcement, Toshiba starts mass production of the T4KA7, a 20MP, 1/2.4-inch CMOS sensor based on 1.12um BSI pixels. The sensor makes possible the realization of 20MP mobile camera modules with a height of 6mm or less.
IS Auto 2015 Speakers
Smithers Image Sensors Auto conference to be held on June 23-25 in Brussels, Belgium announces a list of confirmed speakers including:
Also, Image Sensors publishes an interview with Markus Rossi, Chief Innovation Officer, Heptagon on the company's 3D imaging solutions. Few quotes:
"Optimizing image sensors for 3D imaging is an opportunity, since those system typically have different optical requirement and layout. A key aspect of Heptagon’s products their small mechanical form factor. A novel, wafer-based camera assembly technology - called “FCP” - reduces the mechanical complexity of the camera and projection modules and therefore enables high turn-over, passive alignment manufacturing methods."
"One example for a very important component in depth sensing is the so-called IR illuminator. Our miniature illumination systems are optimised for uniform illumination in ToF applications, pattern generators for contrast enhancement in active stereo as well as structured light systems. Each of this systems needs to be tuned for best optical performance (efficiency, contrast, …) and smallest form factor (need to fit into mobile devices)."
- Henrik Lind
Technical Expert
Volvo Car Corporation - Martin Edney
Lead Systems Engineer Rear & Surround Cameras Advanced Driver Assistance Systems
Jaguar Land Rover - Kevin Lu
Global Manager - Optical Engineering, Product Architect - Image Vision Systems
Magna Electronics - Salah Hadi
Global R&D Director Vision & Night Vision Systems
Autoliv - Riccardo Mariani
CTO
Yogitech - Benjamin Stauss
R&D Engineer – Optical Camera Testing
TriOptics
Also, Image Sensors publishes an interview with Markus Rossi, Chief Innovation Officer, Heptagon on the company's 3D imaging solutions. Few quotes:
"Optimizing image sensors for 3D imaging is an opportunity, since those system typically have different optical requirement and layout. A key aspect of Heptagon’s products their small mechanical form factor. A novel, wafer-based camera assembly technology - called “FCP” - reduces the mechanical complexity of the camera and projection modules and therefore enables high turn-over, passive alignment manufacturing methods."
"One example for a very important component in depth sensing is the so-called IR illuminator. Our miniature illumination systems are optimised for uniform illumination in ToF applications, pattern generators for contrast enhancement in active stereo as well as structured light systems. Each of this systems needs to be tuned for best optical performance (efficiency, contrast, …) and smallest form factor (need to fit into mobile devices)."
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