latest technology in electronics
Kamis, 07 Agustus 2014
Apple Proposes Stacked Sensor with Vertical TG
With a proliferation of FinFETs and other 3D devices, it's just a matter of time to see them adapted in image sensors. Apple patent application US20140211056 "
Vertically stacked image sensor
" by Xiaofeng Fan seems to propose exactly that:
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